# INSACO Inc.

This MFR.ID profile was supplied, reviewed, and approved by INSACO Inc.. Originally approved on 10/29/2025; last updated 2/26/2026. Capability data is manufacturer-approved for public sourcing and RFQ use.

## Profile Links

- Canonical profile: https://mfr.io/insaco
- JSON data: https://mfr.io/insaco.json

## Company Overview

Since 1947, INSACO Inc. has been a U.S.-based precision machining and polishing fabricator of technical ceramics, sapphire, glass and quartz. Operating a Quakertown, PA corporate/manufacturing location, INSACO machines ultra-hard materials to extremely tight tolerances (often measured in millionths of an inch), supports lights-out and robotic production, and maintains extensive metrology and traceability practices to document dimensional conformity and raw-material lot identity for high-reliability applications.

## Quick Reference

- Processes: Post-Fired Ceramic & Sapphire Machining, Polishing / Grinding, Inspection & Quality Control, Engineering & Design Services
- Lead Time: 2-12 weeks
- Production Scale: Prototype (1-10 parts), Short Run (11-500 parts), Medium Run (501-10000 parts), Mass Production (10001+ parts)
- Location: Quakertown, PA 18951
- Employees: 50-60
- Revenue: $12.5M-$20M
- Founded: 1947
- Contact: sales@insaco.com - +1 215-536-3500
- Verified: Manufacturer Approved

## Capabilities

### Precision Ceramic & Sapphire Machining

INSACO machines fully fired technical ceramics and sapphire using diamond OD/ID and centerless grinding, surface and contour grinding, jig grinding, diamond drilling, internal and external thread grinding, and precision honing. Sequenced processes limit subsurface damage while holding ±0.0001 in routinely and near ±0.00004 in on matched fits. Multi-axis workflows and robotic cells support prototypes through production for complex, multi-feature parts others will not touch.

- Process: Post-Fired Ceramic & Sapphire Machining
- Highlights: Micron-class tolerances on OD/ID, flatness, and positional features, Fully fired ceramic and sapphire threading, holes, slots, and contours, OD/ID grinding, flat grinding, and centerless for roundness/cylindricity, Deep-hole drilling and cross-drilling for intersecting galleries, Honing and super-finishing for tight-clearance piston/sleeve bores
- Subprocesses: OD / ID Cylindrical Grinding, Precision Flat Surface Grinding, Surface Grinding, Centerless Thru-feed Grinding, CNC Milling, CNC Jig Grinding, Deep-Hole / Gun Drilling, Cross Drilling, Bore Super-finishing / Micro-Honing, Honing
- Specifications:
  - Bore Size Tolerance (Honing / Super Finishing): 0.00004 in - For tight-clearance bores used in piston/sleeve assemblies and metering components; paired with roundness control for leak-free performance.
  - Cylindricity / Roundness: 0.00004 in - Roundness and cylindricity routinely controlled on OD/ID grinding and centerless operations; 100% checks applied on critical rods and sleeves.
  - Maximum Part Size (Guidance): Process-dependent; provide envelope and critical features for confirmation, Large-envelope CNC/grinding available for oversized plates and rings - Final limits depend on fixturing access, reachable wheel geometry, and metrology path; complex parts may split into sub-components.
  - Production Scale: Prototype (1-10 parts), Short Run (11-500 parts), Medium Run (501-10000 parts), Mass Production (10001+ parts) - No minimum order quantity. Lights-out cells support economical high-volume; engineering support maintains consistency across repeats.
  - Dimensional Tolerance — Matched Fits (Best Case): 0.00004 in - Achieved on piston/sleeve-type paired components and similar fits; requires process sequencing and verification specific to the assembly.
  - Dimensional Tolerance — Routine: 0.0001 in - Typical across OD/ID diameters, flats, and bores on fully fired ceramics/sapphire when drawings and fixturing are aligned to post-fired reality.
  - Material Removal (Diamond Grinding): 0.00001-0.005 in/pass - Typical radial/pass removal on fired ceramics and sapphire; conservative feeds protect surface integrity and minimize micro-cracking.
  - Inspection Methods (In Process / Final): CMM probing/scanning, Video/optical measurement, Roundness and cylindricity gauges, Laser micrometry, Full serialization and traceable records - Measurement plans align to GD&T callouts; critical features may be 100% inspected. See Metrology & QA capability for full details.
  - Minimum Feature Guidance: Through-hole: ≈ 0.015 in (material/thickness dependent), Slot width: ≈ 0.010 in (short spans); wider for long spans, Fillet/radius: keep ≥ 0.005 in where possible to reduce chipping - Brittle materials benefit from generous radii, uniform sections, and stress-relief features; avoid knife edges and abrupt section changes.
  - Threading Of Fully Fired Ceramics: Internal threading (ID) and external thread grinding (OD), Unified (UNC) and Metric (M) forms; specials on review, Thread gaging per System 22 (or per print) - Minimum practical thread size depends on wall thickness, material, and engagement length; provide thread class and gage requirement at RFQ.
  - Materials Machined: Sapphire (single-crystal Al2O3), Alumina (94%–99.95%), Zirconia (Y-TZP, PSZ, ZTA), Silicon Carbide (sintered, RB-SiC, CVD SiC), Silicon Nitride (Si3N4), Aluminum Nitride (AlN), Fused Quartz / Fused Silica, Glass-Ceramics (Zerodur, ULE, Macor), Tungsten Carbide, Boron Carbide, Silicon - Post-fired machining only; INSACO does not manufacture ceramic material. If your material is not listed, provide composition/datasheet for feasibility.
  - True Position (Hole/Feature): 0.0004 in - GD&T true position for drilled/ground features measured against datum scheme; tighter possible on short stack-ups with local datum strategies.
  - Lead Times (Typical): 2-12 weeks - Prototypes: ~2–4 weeks when material is available. Production lots: ~6–12 weeks depending on complexity, inspection scope, and current load.
  - Compliance & Credentials: ITAR / DDTC registered, ISO 9001:2015 compliant QMS - Suitable for aerospace/defense, semiconductor, medical, and optics programs; audit-ready documentation available on request.
  - Surface Finish (As Ground): 20-63 µin Ra - Typical from precision diamond grinding. For ≤ 1 µin Ra or optical clarity, use the Lapping & Optical-Grade Polishing capability.
  - Typical Hole Diameter Tolerance: 0.0002 in - On short through-holes or shallow depths with stable fixturing; deep features require adjusted limits and sequencing.
  - Minimum Hole Diameter (Diamond Drilled): 0.015 in - Smaller features are application-dependent and driven by thickness, material, and aspect ratio. Provide stack-up and intended use for evaluation.
  - Machining Axes & Automation: Multi-axis OD/ID and surface/contour grinding, CNC jig grinding for precision forms, Robotic tending / lights-out cells for repeat production - Process plans sequence multiple machines and inspections to control heat input and subsurface damage while maintaining repeatability.

### Precision Lapping & Optical-Grade Polishing

Flat and cylindrical lapping plus optical-grade polishing for ceramics, sapphire, glass, and quartz deliver fractional-wave flatness, controlled wedge/parallelism, and finishes near 1 µin Ra. Verification uses Zygo interferometry and optical profilometry; finished surfaces are ultrasonically cleaned and packaged at INSACO for optics, wafer carriers, precision seal faces, and vacuum-exposed hardware. Process stacks include single- and double-side flat lapping, OD/ID polish, and CMP.

- Process: Polishing / Grinding
- Highlights: Fractional-wave flatness and micro-inch Ra finishes on flats and rounds, Process stacks for damage-free optical surfaces on sapphire/glass, Tight wedge/parallelism control across wafer-like geometries, Ultrasonic clean and protected pack for contamination-sensitive parts
- Subprocesses: Lapping, Precision Flat Surface Grinding, Surface Grinding, OD / ID Cylindrical Grinding, CNC Jig Grinding, Ultrasonic Cleaning
- Specifications:
  - Surface Finish — Polished (OD/ID/Flats): 0.04-1 µin Ra - Typical polished surfaces ≤ 1 µin Ra; best cases approach ~0.04 µin Ra on select materials/geometries.
  - Measurement & Verification: Zygo interferometry (flatness/figure), Optical profilometry (Ra/Rq maps), CMM/vision for datum-to-feature relationships - Inspection plan ties optical metrology to geometric datums; provide acceptance criteria (e.g., P-V, RMS, aperture).
  - ID/OD Polishing (Cylindrical): 0.5-4 µin Ra - Minimums depend on L/D and fixturing access.
  - Wedge / Parallelism (Thickness Variation): 1 waves/in - Thickness variation expressed as optical waves per inch across wafer-like parts.
  - Flatness — Optical Flats (Interferometric): Up to 0.25 waves @ 632.8 nm - Fractional-wave flatness verified via interferometry; tighter on smaller apertures with optimized fixturing.
  - Lead Times (Typical): 2-12 weeks - Polish-only small lots ~2–6 weeks; complex optics or large lots ~6–12 weeks depending on figure/flatness and cleaning/packaging scope.
  - Thickness Uniformity (Across Part): Up to 0.0002 in - Representative guidance for polished carriers/windows; actual uniformity depends on footprint, cutouts, and support.
  - Scratch/Dig (Optical Surface Quality): 80-50 (typical production optics), 60-40 (precision optics), 20-10 & 40-20 (select materials/geometries) - Specify MIL-style requirement and inspection aperture.
  - Surface Finish — As Lapped (Pre Polish): 0.5-8 µin Ra - Flat lapping for sealing faces or as a pre-polish step prior to optical finishing.
  - Feature Preservation During Polish: Masking and localized polish to protect toleranced features, Fixturing to maintain datum relationships, Sequencing with interim inspection gates - Maintains geometry on holes/slots while achieving finish/flatness on critical faces.
  - Cleanliness & Packaging: Ultrasonic clean (multi-stage), Part-by-part protection (interleaves, trays, peelable films) - Delivered ready for optics/vacuum handling.
  - Materials Polished: Sapphire (single-crystal Al2O3), Fused Quartz / Fused Silica, Optical Glass (e.g., BK7, borosilicates), Glass-Ceramics (Zerodur, ULE, Macor), Alumina (94%–99.9%), Zirconia (Y-TZP, PSZ, ZTA), Silicon Carbide (sintered, RB-SiC, CVD SiC), Silicon Nitride (Si3N4), Aluminum Nitride (AlN), Tungsten Carbide - Subsurface-damage–free lapping and optical polishing across optical and technical-ceramic substrates; provide grade/datasheet for best process plan.
  - Production Scale: Prototype (1-10 parts), Short Run (11-500 parts), Medium Run (501-10000 parts), Mass Production (10001+ parts) - Batch polishing supported; capacity scales to steady-state production once specs are locked.
  - Edge Conditions: Chamfered or beveled edges (standard), Polished edges on request, Edge radius to reduce chipping - Edge preparation matched to handling and installation needs.
  - Flatness — Lapped Mechanical Faces: 1 waves/in - Flatness expressed in optical waves per inch across lapped faces.

### Advanced Metrology & Quality Assurance

Climate-controlled inspection pairs large-envelope CMMs, video/optical metrology, interferometry (to 1/20-wave), roundness/cylindricity gauges, and laser marking within INSACO’s ISO 9001-compliant quality system and ITAR/DDTC-compliant practices. Programs support AS9102 FAIR and PPAP, with 100% checks on critical rods and bores and SPC on production lots. Full serialization and material traceability underpin repeatable millionths-level tolerances and audit-ready data packs for aerospace, medical, and semiconductor customers.

- Process: Inspection & Quality Control
- Highlights: Bridge/gantry CMMs, portable arms, and 3-D scanning, AS9102 FAI and PPAP data packs with traceable measurement, Thread gauging to System 22; SPC monitoring on critical features, Serialization and controlled environments for repeatable accuracy
- Subprocesses: 3D Coordinate Measurement, 3D Laser Scanning Inspection, Dimensional Inspection, First Article Inspection (AS9102), System 22 Thread Gauging, Ultrasonic Wall-Thickness Testing, Pressure / Leak Testing, Real-Time SPC, Laser Engraving
- Specifications:
  - Calibration & Traceability: NIST / ISO/IEC 17025 calibration traceability, ITAR / DDTC compliant - Certificates and calibration records maintained; available for customer and audit review.
  - Standards & Methods: ASME Y14.5 GD&T, ISO 10360 (CMM), AS9102 FAIR, IATF 16949 PPAP - Measurement plans and reporting aligned to customer-specified standards; FAIR/PPAP templates on request.
  - Vision/Optical Measurement Resolution: Up to 0.0001 in - High-magnification video/optical systems used for small features, edges, slots, and clear/translucent substrates.
  - Production Scale: Prototype (1-10 parts), Short Run (11-500 parts), Medium Run (501-10000 parts), Mass Production (10001+ parts) - Inspection capacity scales from single-piece qualification to steady-state production control.
  - Environmental Control — Temperature: 66-70 °F - Metrology areas maintained around 68 °F to minimize thermal expansion during measurement.
  - Sampling Plans: 100% inspection on critical characteristics as requested, AQL per ANSI/ASQ Z1.4, Level III, 0 AQL, C=0 sampling on request - Control plans identify critical-to-quality characteristics and the corresponding sampling approach.
  - Environmental Control — Humidity: 30-50 %RH - Typical controlled range; instrument-specific limits observed to protect optics and electronics.
  - Roundness / Cylindricity Measurement Capability: Up to 10 µin - Talyrond-class instruments verify 360° profiles on rods, sleeves, rings, and precision bores.
  - Inspection Scope: Incoming, In-process, Final - End-to-end coverage with gated inspection plans tied to drawing GD&T and risk level.
  - Serialization & Part Marking: CO₂ laser marking, Laser marking (DPM/barcode), Human-readable serials, Lot/batch linking to records - Traceability links each part to material certs, inspection results, and process history.
  - Surface Roughness Measurement Range: 0.04-500 µin Ra - Optical profilometry and stylus contact methods; roughness spec tied to function (optical, seal, or bearing).
  - Reports & Data Delivery: AS9102 FAIR (Forms 1–3), PPAP Levels 1–5, CSV / PDF / QIF, Ballooned prints / MBD datasets - Digital data packs tie feature IDs to results; QIF/CSV enable downstream SPC and supplier quality ingestion.
  - CMM System Uncertainty (Typical): Up to 0.00002 in - Representative maximum uncertainty over the working volume under 68 °F control; tighter on small parts/short spans.
  - Interferometric Flatness Resolution: Up to 0.05 waves @ 632.8 nm - Up to ~1/20-wave discrimination for polished flats and figured surfaces; provide aperture and pass/fail criteria.
  - CMM Measurement Volume: 47L x 47W x 31H in (1200L x 1200W x 800H mm) - Large-envelope bridge/gantry CMMs for full assemblies and oversized precision flats.
  - Thread Verification: System 22 GO/NO-GO gaging, Pitch diameter verification, Supplemental optical/CMM checks - Functional gage acceptance paired with measurement evidence for ceramic/sapphire threaded features.

### Engineering & Manufacturing Support Services

Early engagement aligns features and tolerances with post-fired reality: DFM/GD&T reviews, tolerance stack-ups, sapphire C-axis orientation guidance, scan-to-CAD reverse engineering, and inspection-plan development. Pilot-to-production lot management and export-control-ready documentation accelerate quoting and onboarding. Engineering support at INSACO reduces risk and cost by tuning drawings for diamond-ground manufacturability and inspection, improving yield on complex ceramic and sapphire components.

- Process: Engineering & Design Services
- Highlights: Design-for-manufacturability and stack-up guidance for ceramics/sapphire, Scan-to-CAD reverse-engineering with GD&T and inspection plans, Lot management and ERP-integrated ramp from pilot to production, Inspection reporting and documentation aligned to ASME/AS standards
- Subprocesses: DFM Analysis, Scan-to-CAD Reverse-Engineering Workflow, Geometric Dimensioning and Tolerancing (GD&T), Inspection Reporting, Prototype-to-Production Lot Management, ERP-Integrated Production Planning, Reverse Engineering
- Specifications:
  - CAD / MBD File Formats Accepted: STEP (AP203/AP214/AP242), IGES, Parasolid (x_t/x_b), SolidWorks (sldprt/sldasm), Creo (prt/asm), NX (prt), DXF / DWG, 3D PDF, STL (for reference only), QIF, PDF (ballooned drawings) - Preferred manufacturing definition is STEP AP242 or native CAD with full GD&T and notes; include a PDF for title-block and callouts.
  - CAD Platforms Supported: SolidWorks, Mastercam, Hypermill, ESPRIT - Multi-CAD/CAM support enables native edits or neutral exchange without loss of GD&T or model intent.
  - Reporting & Deliverables: Redlined DFM report, Revised drawing set (PDF) with notes, Updated CAD/MBD (as agreed), Inspection plan (FAIR/PPAP-ready), Risk & cost driver summary - Deliverables tailored to the program gate (quote, prototype, or production release).
  - Prototype To Production Transition: Pilot run plan with acceptance criteria, Control plan and capability targets (Cp/Cpk), Ramp schedule with feedback gates - Defines the path from first-article success to stable production with measurable quality objectives.
  - GD&T Standards: ASME Y14.5 (latest), ISO 1101 (on request) - Drawings reviewed to ensure unambiguous datums, feature control frames, and measurement feasibility.
  - Revision Control & Change Management: ECR/ECO workflow alignment, Revision stamping on drawings and CAD, Change log delivered with updated packages - Prevents version drift between engineering, manufacturing, and quality records.
  - Inspection Plan Development: Ballooned print / feature ID map, Characteristic classification (critical/major/minor), Gage selection and MSA needs, Sampling plan and acceptance criteria - Plan aligns measurement to function and cost; supports FAIR/PPAP handoff without rework.
  - Preferred Drawing Practices For Ceramics: Add edge radii ≥ 0.005 in where possible, Avoid knife-edges; maintain uniform section thickness, Call out break-edge or chamfer on exposed edges, Specify functional surface finishes separately from cosmetic - Ceramics and sapphire are brittle; geometry and finish callouts directly impact yield and cost.
  - Tolerance Analysis Methods: Worst-case stack-up, Root-Sum-Square (RSS) - Method selected by risk level and functional sensitivity; outputs feed inspection plans and fit targets.
  - Fixturing & Workholding Support: Custom fixture concepts for brittle substrates, Datum simulation for inspection, Quick-change strategies for repeat builds - Fixture concepts provided where they materially reduce risk or cycle time; final design owned per SOW.
  - Acceptance Criteria Definition: Critical-to-quality (CTQ) feature list, Pass/fail thresholds tied to function, Rework/repair guidelines where applicable - Clear criteria accelerate buyoff and reduce back-and-forth during qualification.
  - Production Scale: Prototype (1-10 parts), Short Run (11-500 parts), Medium Run (501-10000 parts), Mass Production (10001+ parts) - Engineering support scales from single-part feasibility to full production transitions with controlled documentation.
  - DFM Review Depth: Material suitability and grade recommendations (ceramics/sapphire), Feature risk review (thin walls, sharp corners, small holes/threads), Tolerancing for post-fired reality (open/close where appropriate), Datum scheme and inspection strategy alignment, Process routing proposal (grind → lap/polish → inspect) - Actionable redlines provided with options to reduce risk, scrap, and cycle time while preserving function.
  - Export Control & Security: ITAR / DDTC compliant, Controlled technical data handling (need-to-know), NDA and secure file exchange - Processes and documentation suitable for A&D programs; access controlled per customer direction.
  - ERP/MES Integration (Lot Management): Lot/serial tracking and traveler generation, Revision-controlled routers/BOMs, Inspection data linking (QIF/CSV) to part records - Ensures continuity from pilot to production; supports traceability and change control.
  - Sapphire C Axis Orientation Guidance: C-axis callout for optical/birefringent behavior, Orientation marks on parts/drawings, Mounting guidance to minimize imaging artifacts - Orientation affects optical performance and mechanical response; include axis requirement in RFQ.
  - Risk & Cost Drivers Identified: Thin walls (< 0.020 in) and long spans, Tight inside corners and sharp transitions, Very small holes/threads with high aspect ratio, Overly broad surface finish specs on non-functional faces - Each driver is flagged with options (geometry tweaks, tolerance changes, sequencing) to protect yield and budget.
  - Lead Times — DFM / GD&T Review: {"unit":"weeks","value":2} - Fixed 2-week turnaround; subject to completeness of data and part count.
  - CAM / Programming Tools: Mastercam, HyperMill, ESPRIT - Listed separately from CAD platforms.

## Certifications

- ITAR Registration (Type: Registration; Authority: U.S. Department of State – Directorate of Defense Trade Controls (DDTC); Status: Unknown; Scope: DDTC registration / ITAR compliance for defense & aerospace machining and supply (as stated on INSACO 'Defense and Aerospace' applications page).; URL: https://www.pmddtc.state.gov)

## Industries Served

- Aerospace & Defense: INSACO Inc. manufactures high-precision ceramic and sapphire components (e.g., ceramic gyroscopic parts, sapphire tubes for infrared countermeasures, and large ceramic composites) used in aerospace and defense guidance, IRCM optical assemblies, and other mission‑critical aircraft systems; company capabilities include tight‑tolerance machining, polishing, and ITAR‑compliant processing for defense flight hardware.
- Medical Devices & Healthcare Equipment: INSACO Inc. produces micro‑scale machined technical ceramic parts and polished sapphire components (such as biocompatible implant interfaces, surgical instrument tips, and ceramic piston/sleeve assemblies) used in medical device and healthcare equipment applications where extreme hardness, wear resistance, and sub‑micron tolerances are required.
- Electronics & Semiconductors: INSACO Inc. fabricates precision sapphire and ceramic carriers, polished optical parts and semiconductor‑grade components (including sapphire wafer carriers and ceramic fixtures) employed in semiconductor manufacturing and analytical instrumentation to provide dimensional stability, contamination resistance, and tight tolerances for wafer handling and process tools.
- Scientific Instrumentation & Analytical Equipment: INSACO Inc. machines high-precision sapphire and ceramic components for use in scientific and analytical instruments, including optical assemblies, precision carriers, and ultra-hard material interfaces requiring sub-micron tolerances and dimensional stability.
- Industrial Robotics & Automation Systems: INSACO Inc. integrates automated machining and robotic handling—deploying lights‑out CNC cells, automated storage/retrieval and robotic fixturing—to deliver high‑volume, repeatable production of hard‑material parts (ceramic and sapphire) for automated assembly, pick‑and‑place, and inspection systems in industrial manufacturing.

## Facilities

### INSACO Corporate & Manufacturing Facility

Primary corporate and manufacturing facility in Quakertown, PA. Expanded to approximately 55,000 sq ft with a dedicated 13,000 sq ft lapping and polishing area. Equipment and QA include diamond OD/ID, centerless and surface/contour grinding, jig grinding, optical- and Zygo interferometry (to 1/20-wave), non-contact metrology to ~0.1 µm, laser marking/serialization, and ultrasonic clean and packaging. Robotics and carousel automation support lights-out production and repeatability for high-reliability programs.

- Type: manufacturing_facility
- Headquarters: Yes
- Email: sales@insaco.com
- Phone: +1 215-536-3500
- Address: 1365 Canary Rd., Quakertown, Pennsylvania 18951, United States

## Verification Status

- Business Entity: Verified 8/27/2025
- Technical Capabilities: Verified 10/29/2025
- Locations & Facilities: Verified 8/27/2025
- Reviews & Ratings: Not yet verified
- MFR.ID Created: 8/27/2025
- Last Updated: 2/26/2026